Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026

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TL;DR

Visualization of co-packaged optics (CPO) platform architecture
Co-packaged optics platforms integrate optical engines directly with switch silicon and AI accelerators to overcome physical copper reach limits.
  • 2nm Optical Milestones: Marvell Technology announced industry-first 2nm optical interconnect demonstrations for AI data center infrastructure at ECOC 2026 in Málaga, Spain.
  • Key Demonstrations: Showcases include the first 2nm 400G-per-lane optical PAM4, the first live 2nm 800G ZR/ZR+ pluggable with MACsec, and the first 2nm 1.6T ZR and O-band coherent-lite technologies.
  • 102.4T Co-Packaged Optics: Marvell is demonstrating a 102.4 Tbps CPO platform with 200G-per-lane silicon photonics to overcome physical copper reach limits in multi-rack AI pods.
  • Scaling to 3.2T: The new 2nm solutions are engineered to advance bandwidth density and lower power per bit as data centers transition from 1.6T toward 3.2T architectures.
  • Comprehensive Showcase: Marvell is featuring 38 advanced technology demonstrations at ECOC 2026, covering 224G SerDes, coherent interconnects, and optical memory fabrics.

As artificial intelligence infrastructure scales at an unprecedented rate, modern hyperscale and cloud data centers face mounting physical challenges in moving data quickly and efficiently. At the European Conference on Optical Communication (ECOC) 2026, held September 20–24 in Málaga, Spain, Marvell Technology, Inc. (NASDAQ: MRVL) announced industry-first 2nm optical interconnect demonstrations aimed at addressing these bottlenecks and powering next-generation AI connectivity.

Concept rendering of high-speed optical transceivers in an AI data center rack
High-speed optical connections allow AI clusters to scale toward 3.2T architectures while reducing power per bit.

The showcase underscores Marvell's ongoing strategy of applying leading-edge semiconductor process nodes to optical and silicon architectures. By advancing to the 2nm manufacturing node, the company aims to deliver critical improvements in bandwidth density, electrical energy efficiency, and high-speed data integrity as AI data center architectures transition from 1.6T to 3.2T configurations and beyond.

First 2nm Optical Demonstrations at ECOC 2026

The demonstrations presented at ECOC 2026 span multiple optical interconnect architectures designed to link accelerators, processors, and distributed data facilities:

First 2nm 400G-per-Lane Optical PAM4

Marvell is demonstrating what it reports as the industry's first 2nm 400G-per-lane optical PAM4 (Pulse Amplitude Modulation 4-level) technology. PAM4 is an advanced signal modulation format that increases the amount of data transmitted over an optical signal by utilizing four distinct voltage levels rather than two. By doubling per-lane throughput to 400G while keeping power consumption low, this technology provides the ultra-high-speed connectivity required to facilitate the data center migration to 3.2T networking.

First Live 2nm 800G ZR/ZR+ with Integrated MACsec

In another demonstration, Marvell is presenting the first live showcase of a 2nm 800G ZR/ZR+ OSFP pluggable transceiver featuring integrated Media Access Control security (MACsec). Powered by the Marvell Libra 2nm coherent digital signal processor (DSP)—which was announced earlier this year—the pluggable module delivers high-performance, power-efficient, and cryptographically secure optical transmission. This solution expands Marvell's COLORZ pluggable and coherent DSP portfolios, supporting hyperscale cloud and AI operators requiring encrypted inter-data center connections.

First 2nm 1.6T ZR and Coherent-Lite O-Band Solutions

Marvell is also exhibiting the first 2nm 1.6T ZR and 1.6T coherent-lite O-band demonstrations. These solutions are powered by next-generation Marvell DSPs announced earlier this year and are optimized to provide high-bandwidth, energy-efficient connectivity both within single data center campuses and between separate regional facilities, laying the groundwork for broader 3.2T network rollouts.

102.4T Co-Packaged Optics for Next-Generation AI Pods

As computing requirements intensify, data center architects face growing limitations with traditional copper wiring. High electrical resistance and signal loss across copper cables severely restrict signal transmission distance as per-lane speeds accelerate, particularly within dense, multi-rack AI pods.

To address this physical barrier, Marvell is showcasing its 102.4T Co-Packaged Optics (CPO) platform at ECOC 2026. Rather than transmitting electrical signals over lengthy copper connections to separate pluggable transceivers on the front panel, CPO integrates optical engines directly alongside AI accelerators and switch silicon. Demonstrated at an aggregate bandwidth of 102.4 Tbps using 200G-per-lane silicon photonics, the platform significantly enhances bandwidth density and reduces power per bit, enabling multi-rack AI fabrics to scale efficiently past copper's reach limits.

Evolution of Marvell's Optical DSP Roadmap

The new 2nm demonstrations build on Marvell's multi-generational track record of process node transitions in optical connectivity. According to the company, key milestones leading up to the 2nm demonstrations include:

  • 2023: Introduction of the industry's first 5nm 200G-per-lane 1.6T Marvell Nova DSP family.
  • 2024: Launch of the 3nm 1.6T Ara platform.
  • Earlier in 2026: Announcement of the 2nm 800G Libra DSP platform.
  • ECOC 2026: Extension of the 2nm portfolio to include optical PAM4, coherent-lite PAM4/IMDD (Intensity Modulation Direct Detection), and ZR/ZR+ coherent architectures.

By migrating these architectures to 2nm, Marvell aims to help data center operators manage the soaring energy demands generated by massive artificial intelligence clusters.

Why 2nm Optical Connectivity Matters for AI Workloads

Modern AI workloads—including the training and inference of advanced models—depend heavily on distributed architectures that span multiple physical domains:

  • Scale-Up: High-bandwidth, low-latency inter-chip communication linking XPUs, central processing units (CPUs), accelerators, and shared memory within compute nodes.
  • Scale-Out: High-speed optical networking connecting thousands of discrete compute pods across a data center cluster.
  • Scale-Across: Secure, high-capacity links connecting disparate data center facilities and regional campuses.

According to Xi Wang, senior vice president and general manager of the Connectivity Business Unit at Marvell, balancing these requirements with operational constraints is paramount for cloud providers:

“AI data center operators need optical interconnect technologies that deliver higher bandwidth, lower power and greater security across every part of the network,” said Xi Wang. “These ECOC demonstrations highlight how Marvell continually pushes the envelope of what is possible in optical technology to help hyperscaler and cloud data center customers achieve new levels of performance, efficiency and scalability to drive new waves of innovation.”

Showcase and Executive Sessions at ECOC 2026

Marvell is demonstrating the breadth of its AI infrastructure technologies through 38 advanced demonstrations at ECOC Booth #2002, developed internally and alongside its partner ecosystem. In addition to the headline 2nm demonstrations, the company is presenting technologies ranging from 224G SerDes and 1.6T optics to coherent interconnects and optical memory fabrics.

Alongside the product showcases, Marvell executives and technical specialists are participating in conference presentations and panels. These sessions include a fireside chat on emerging optical technologies featuring Xi Wang, as well as presentations by several other Marvell optical experts examining connectivity designs for future AI infrastructure.

Frequently Asked Questions

What 2nm optical technologies did Marvell demonstrate at ECOC 2026?

At ECOC 2026, Marvell announced demonstrations including the first 2nm 400G-per-lane optical PAM4, the first live demonstration of 2nm 800G ZR/ZR+ with integrated MACsec, and the first 2nm 1.6T ZR and O-band coherent-lite interconnects.

What is the Marvell 102.4T CPO platform?

The Marvell 102.4T Co-Packaged Optics platform directly integrates optical engines with switch silicon and AI accelerators using 200G-per-lane silicon photonics. This architecture delivers high bandwidth density and power efficiency while bypassing copper distance limits in multi-rack AI fabrics.

When and where is ECOC 2026 taking place?

The European Conference on Optical Communication (ECOC) 2026 is being held September 20–24, 2026, in Málaga, Spain. Marvell is exhibiting its technology demonstrations at Booth #2002.

Why is the migration to 2nm silicon important for optical transceivers?

Advancing optical digital signal processors to the 2nm node increases bandwidth density and lowers power per bit. This efficiency is critical for hyperscale operators managing escalating power demands while upgrading data center networks from 1.6T to 3.2T architectures.

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